EDFA embedding moulds, silicone rubber Diameter:31.8mm Radius: 1/16 to 3/8" (1/32"
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EDFA embedding moulds, silicone rubber Diameter:31.8mm Radius: 1/16 to 3/8" (1/32"These silicone moulds are designed for moulding small samples, cross sections, or similar for performance and failure analysis of semiconductor flip chip packaged devices (EDFA). The moulds drastically reduce the surface area of exposed resin, improve the view of thin, tall samples, reduces the volume of resin required and consumption of polishing supplies. Sample moulds available for use with the PELCO Pressure Pot which enables curing of up to
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